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1535 د.إ
The ASUS PRIME X670E-PRO WIFI offers this all in a sleek, futuristic-looking package centered around a spaceship design aesthetic, with a silver-toned nameplate and chipset cover.
CPU Performance Boost:
The TurboV Processing Unit (TPU) is an intelligent system-tuning utility that automatically fine-tunes voltages, monitors system stats and adjusts overclocking parameters for optimal performance.
M.2 Heatsink:
Three M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers.
VRM Heatsink and Thermal Pads:
The two VRM heatsinks on PRIME X670E-PRO WIFI are significantly larger than those found on earlier X570 motherboards. Together with the thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.
Cooler by Design:
PRIME X670E-PRO WIFI features comprehensive cooling controls that are configurable via Fan Xpert 4 software or via the UEFI BIOS.
Multiple Temperature Sources:
Each header can dynamically reference three thermal sensors. Fan Xpert 4 allows you to map the temperature of supported ASUS graphics cards to optimize cooling for GPU- and CPU-intensive tasks.
ProCool Connectors:
Proprietary connectors augment the motherboard’s link to the PSU with 8+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.
4-Pin PWM/DC Fan:
Each onboard header supports auto-detection of PWM or DC fans.
Smart Protection:
A dedicated integrated circuit protects each fan header from overheating and overcurrent.
Dual-Pump Headers:
A dedicated header supplies over 3 amps* for high-performance PWM or DC water pumps, plus a second dedicated header for AIOs.
*AIO Pump header supports 1 amp, and Water Pump+ header supports 3 amps.
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1535 د.إ
The ASUS PRIME X670E-PRO WIFI offers this all in a sleek, futuristic-looking package centered around a spaceship design aesthetic, with a silver-toned nameplate and chipset cover.
Easy Process: Quick and hassle-free trade-in and Eco-Friendly: Help reduce e-waste and contribute to a sustainable future.
CPU Performance Boost:
The TurboV Processing Unit (TPU) is an intelligent system-tuning utility that automatically fine-tunes voltages, monitors system stats and adjusts overclocking parameters for optimal performance.
M.2 Heatsink:
Three M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers.
VRM Heatsink and Thermal Pads:
The two VRM heatsinks on PRIME X670E-PRO WIFI are significantly larger than those found on earlier X570 motherboards. Together with the thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.
Cooler by Design:
PRIME X670E-PRO WIFI features comprehensive cooling controls that are configurable via Fan Xpert 4 software or via the UEFI BIOS.
Multiple Temperature Sources:
Each header can dynamically reference three thermal sensors. Fan Xpert 4 allows you to map the temperature of supported ASUS graphics cards to optimize cooling for GPU- and CPU-intensive tasks.
ProCool Connectors:
Proprietary connectors augment the motherboard’s link to the PSU with 8+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.
4-Pin PWM/DC Fan:
Each onboard header supports auto-detection of PWM or DC fans.
Smart Protection:
A dedicated integrated circuit protects each fan header from overheating and overcurrent.
Dual-Pump Headers:
A dedicated header supplies over 3 amps* for high-performance PWM or DC water pumps, plus a second dedicated header for AIOs.
*AIO Pump header supports 1 amp, and Water Pump+ header supports 3 amps.
There are no reviews yet.
1535 د.إ
The ASUS PRIME X670E-PRO WIFI offers this all in a sleek, futuristic-looking package centered around a spaceship design aesthetic, with a silver-toned nameplate and chipset cover.
CPU Performance Boost:
The TurboV Processing Unit (TPU) is an intelligent system-tuning utility that automatically fine-tunes voltages, monitors system stats and adjusts overclocking parameters for optimal performance.
M.2 Heatsink:
Three M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers.
VRM Heatsink and Thermal Pads:
The two VRM heatsinks on PRIME X670E-PRO WIFI are significantly larger than those found on earlier X570 motherboards. Together with the thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.
Cooler by Design:
PRIME X670E-PRO WIFI features comprehensive cooling controls that are configurable via Fan Xpert 4 software or via the UEFI BIOS.
Multiple Temperature Sources:
Each header can dynamically reference three thermal sensors. Fan Xpert 4 allows you to map the temperature of supported ASUS graphics cards to optimize cooling for GPU- and CPU-intensive tasks.
ProCool Connectors:
Proprietary connectors augment the motherboard’s link to the PSU with 8+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.
4-Pin PWM/DC Fan:
Each onboard header supports auto-detection of PWM or DC fans.
Smart Protection:
A dedicated integrated circuit protects each fan header from overheating and overcurrent.
Dual-Pump Headers:
A dedicated header supplies over 3 amps* for high-performance PWM or DC water pumps, plus a second dedicated header for AIOs.
*AIO Pump header supports 1 amp, and Water Pump+ header supports 3 amps.
There are no reviews yet.
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