PRIME X670-P WIFI

CPU Performance Boost

AMD Precision Boost Overdrive(PBO) pushes the CPU current and voltage budget to opportunistically increase performance. By aggressively tuning the PBO parameters, AMD‘s algorithm can leverage the motherboard’s robust power solution to ramp up performance even higher.

COOLING

PRIME X670 series is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.

M.2 Heatsink

An M.2 heatsink takes care of the M.2 slot, warding off throttling that can occur with M.2 storage during sustained transfers.

Chipset: AMD X670

Size format: ATX 30.5×24.4cm
Support for processors: AMD Ryzen™ 7000 series
Processor socket: AM5

Memory:

• 4x DIMMs, Max. 128GB, DDR5 6400+(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600(OC)/ 5400(OC)/ 5200/ 5000/ 4800, ECC and non-ECC, unbuffered
• dual-channel memory architecture
• supports AMD Extended Profiles for Overclocking (EXPO™) OptiMem II

Graphics Card

• 1x DisplayPort 1.4
• 1x HDMI® 2.1

Sound card: Realtek 7.1 Surround Sound High Definition Audio CODEC
– supports: jack detection, Multi-streaming, redesign of front panel jacks
– supports playback up to 24-bit/192kHz

Ethernet: 1x Realtek 2.5Gb
WLAN + Bluetooth: 2×2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax), supports 2.4/5GHz frequency band + Bluetooth v5.2

Expansion Slots:

• 1x PCIe 4.0 x16 slot (supports x16 mode)
• 2x PCIe 4.0 x16 slots (supports x4 mode)
• 1x PCIe 3.0 x1 slot

RAID controller: AMD RAIDXpert2 technology supports both NVMe RAID 0/1/10 and SATA RAID 0/1/10

Specifications