ASUS TUF GAMING X870-PRO WIFI7 W NEO AM5 ATX Motherboard (90MB1NY0-M0EAY0)

Product Overview

The ASUS TUF GAMING X870-PRO WIFI7 W NEO is a flagship-grade ATX motherboard built for AMD AM5 systems, combining extreme performance, AI-powered optimization, and military-grade durability. Designed for gamers, creators, and professionals, it delivers a powerful and future-ready platform for high-end builds.

AMD AM5 Next-Gen Platform

Supports AMD Ryzen 9000, 8000, and 7000 series processors, offering exceptional performance for gaming, streaming, and AI-driven workloads.

Extreme Power Delivery

Equipped with a 16+2+1 (80A) power stage design and enlarged VRM heatsinks, ensuring stable performance even under heavy loads and overclocking conditions.

Advanced DDR5 Performance

Supports DDR5 memory up to 256GB with speeds exceeding 9600 MT/s (OC), enhanced by NitroPath DRAM technology and AEMP for effortless performance tuning.

PCIe 5.0 & High-Speed Storage

Features a PCIe 5.0 x16 SafeSlot for next-gen GPUs and four M.2 slots (including two PCIe 5.0), delivering ultra-fast storage performance.

AI-Powered System Optimization

Includes ASUS AI Advisor, AI Overclocking, AI Cooling II, AI Networking II, and AI Cache Boost for intelligent performance tuning and system management.

Advanced Overclocking Technologies

Dynamic OC Switcher, Core Flex, and Asynchronous Clock enable precise control over CPU performance, power, and thermals.

Ultra-Fast Connectivity

Offers WiFi 7, 5Gb Ethernet, USB4 (40Gbps), and front USB 20Gbps Type-C with fast charging support for cutting-edge connectivity.

Comprehensive Cooling Design

Enhanced VRM heatsinks and optimized thermal design ensure efficient heat dissipation and consistent performance during long gaming sessions.

TUF Durability & Reliability

Built with high-quality components and tested under rigorous conditions, ensuring long-term durability and stability.

Ideal for High-End Gaming & AI Builds

Perfect for enthusiasts, gamers, and professionals seeking top-tier performance, next-gen connectivity, and reliable durability.